US Patent Issued to Intel on July 21 for "Multiple targets on substrate layers for layer alignment" (Oregon Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,687,793, issued on July 21, was assigned to Intel Corp. (Santa Clara, Calif.).

"Multiple targets on substrate layers for layer alignment" was invented by Shakul Tandon (Hillsboro, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments described herein may be related to apparatuses, processes, and techniques related to using full stack overlay cell (FSOL) targets within lithography masks and on fabricated layers of a substrate in order to align or to assess the alignment of fabricated layers of the substrate during the substrate manufacturing process. Other embodiments may be described and/or claimed."

The patent was filed on Dec. 24, 2021, und...