US Patent Issued to Intel on July 14 for "Sidelink relay enhancements to support multipath" (Oregon, California Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,454, issued on July 14, was assigned to Intel Corp. (Santa Clara, Calif.).

"Sidelink relay enhancements to support multipath" was invented by Sangeetha L. Bangolae (Portland, Ore.), Rafia Malik (Hillsboro, Ore.), Youn Hyoung Heo (San Jose, Calif.) and Ansab Ali (Beaverton, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments herein provide techniques related to sidelink relay enhancements in a cellular network. In some embodiments, a UE may include circuitry configured to identify, from a gNodeB (gNB) of a serving cell to which the UE and one or more relay UEs belong, a medium access control (MAC) control element (CE); and identif...