ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,222, issued on July 14, was assigned to Intel Corp. (Santa Clara, Calif.).
"Package architecture with memory chips having different process regions" was invented by Sagar Suthram (Portland, Ore.), Wilfred Gomes (Portland, Ore.), Nisha Ananthakrishnan (Chandler, Ariz.), Kemal Aygun (Tempe, Ariz.), Ravindranath Vithal Mahajan (Chandler, Ariz.), Debendra Mallik (Chandler, Ariz.), Pushkar Sharad Ranade (San Jose, Calif.) and Abhishek A. Sharma (Hillsboro, Ore.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of a microelectronic assembly include: a first integrated circuit (IC) die having a first memory circuit and a second memory circuit; a s...