US Patent Issued to Intel on July 14 for "Glass-based cavity and channels for cooling of embedded dies and 3D integrated modules using package substrates with glass core" (Arizona, Oregon Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,161, issued on July 14, was assigned to Intel Corp. (Santa Clara, Calif.).

"Glass-based cavity and channels for cooling of embedded dies and 3D integrated modules using package substrates with glass core" was invented by Aleksandar Aleksov (Chandler, Ariz.), Telesphor Kamgaing (Chandler, Ariz.), Neelam Prabhu Gaunkar (Chandler, Ariz.), Georgios C. Dogiamis (Chandler, Ariz.) and Veronica Strong (Hillsboro, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include package substrates and methods of forming such package substrates. In an embodiment a package substrate comprises a core with a first surface and a second surf...