US Patent Issued to Intel on Feb. 24 for "Replacement conductive material for interconnect features" (California, Oregon Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,030, issued on Feb. 24, was assigned to Intel Corp. (Santa Clara, Calif.).

"Replacement conductive material for interconnect features" was invented by Prashant Majhi (San Jose, Calif.) and Anand Murthy (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit structure includes a first interconnect layer including a first dielectric material. The first dielectric material has a first recess therein, the first recess having a first opening. The integrated circuit structure further includes a second interconnect layer above the first interconnect layer. The second interconnect layer includes a second dielectric material that...