US Patent Issued to Intel on Feb. 24 for "Microelectronic assembly with underfill flow control" (Oregon, Arizona Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,085, issued on Feb. 24, was assigned to Intel Corp. (Santa Clara, Calif.).

"Microelectronic assembly with underfill flow control" was invented by Frederick Atadana (Hillsboro, Ore.) and Jean Bosco Kana Kana (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A microelectronic assembly comprises a first microelectronic component; a second microelectronic component under an area of the first microelectronic component and coupled to the first component through first interconnect structures within a central region of the area, and second interconnect structures within a peripheral region of the area, adjacent to the central region. A heterog...