US Patent Issued to Intel on Feb. 24 for "Integrated circuit structures with deep via structure" (Oregon Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,774, issued on Feb. 24, was assigned to Intel Corp. (Santa Clara, Calif.).

"Integrated circuit structures with deep via structure" was invented by Leonard P. Guler (Hillsboro, Ore.), Charles H. Wallace (Portland, Ore.) and Tahir Ghani (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Integrated circuit structures having deep via structures, and methods of fabricating integrated circuit structures having deep via structures, are described. For example, an integrated circuit structure includes a plurality of horizontally stacked nanowires. A gate structure is over the plurality of horizontally stacked nanowires. An epitaxial source or dra...