US Patent Issued to Intel on Feb. 17 for "Semiconductor package with embedded optical die" (Arizona, California Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,554,077, issued on Feb. 17, was assigned to Intel Corp. (Santa Clara, Calif.).

"Semiconductor package with embedded optical die" was invented by Vivek Raghunathan (Tempe, Ariz.) and Myung Jin Yim (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor package with one or more optical die(s) embedded therein is disclosed. The optical die(s) may have one or more overlying interconnect layers. Electrical contact to the optical die may be via the one or more overlying interconnect layers. An optical waveguide may be disposed next to the optical die and embedded within the semiconductor package. An optical fiber may be optically couple...