US Patent Issued to Intel on Aug. 4 for "Substrate trench for improved hybrid bonding" (Singaporean, American Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,044, issued on Aug. 4, was assigned to Intel Corp. (Santa Clara, Calif.).

"Substrate trench for improved hybrid bonding" was invented by Zhihua Zou (Singapore), Omkar Karhade (Chandler, Ariz.), Botao Zhang (Gilbert, Ariz.), Julia Chiu (Portland, Ore.), Vivek Chidambaram (Singapore), Yi Shi (Chandler, Ariz.), Mohit Bhatia (Chandler, Ariz.) and Mostafa Aghazadeh (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Bonding pedestals on substrates, and their manufacture, for direct bonding integrated circuit (IC) dies onto substrates. The electrical interconnections of one or more IC dies and a substrate are bonded together with the IC dies on...