US Patent Issued to Intel on Aug. 4 for "Microelectronic assemblies with inductors in direct bonding regions" (Arizona, Oregon, California Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,724, issued on Aug. 4, was assigned to Intel Corp. (Santa Clara, Calif.).

"Microelectronic assemblies with inductors in direct bonding regions" was invented by Adel A. Elsherbini (Chandler, Ariz.), Krishna Bharath (Phoenix), Kevin P. O'Brien (Portland, Ore.), Kimin Jun (Portland, Ore.), Han Wui Then (Portland, Ore.), Mohammad Enamul Kabir (Portland, Ore.), Gerald S. Pasdast (San Jose, Calif.), Feras Eid (Chandler, Ariz.), Aleksandar Aleksov (Chandler, Ariz.), Johanna M. Swan (Scottsdale, Ariz.) and Shawna M. Liff (Scottsdale, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein are microelectronic assemblies including microelectronic...