US Patent Issued to Intel on Aug. 4 for "Memory on package (MOP) with reverse CAMM (compression attached memory module) and CMT connector" (American, Malaysian, Costa Rican Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,062, issued on Aug. 4, was assigned to Intel Corp. (Santa Clara, Calif.).

"Memory on package (MOP) with reverse CAMM (compression attached memory module) and CMT connector" was invented by George Vergis (Portland, Ore.), Min Suet Lim (Gelugor, Malaysia), Luis Carlos Alvarez Mata (Cartago, Costa Rica), Ankita Tiwari (Sunnyvale, Calif.) and Xiang Li (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Memory on Package (MOP) apparatus with reverse CAMM (Compression Attached Memory Module) and compression mount technology (CMT) connector(s). The MOP includes a first (MOP) substrate to which one or more CPUs, SoC, and XPUs that is operatively c...