US Patent Issued to Intel on Aug. 4 for "Glass core patches embedded in encapsulating material for packaged integrated circuit devices" (Arizona Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,057, issued on Aug. 4, was assigned to Intel Corp. (Santa Clara, Calif.).

"Glass core patches embedded in encapsulating material for packaged integrated circuit devices" was invented by Jeremy D Ecton (Gilbert, Ariz.), Leonel R. Arana (Phoenix), Brandon C Marin (Chandler, Ariz.), Srinivas Venkata Ramanuja Pietambaram (Chandler, Ariz.) and Gang Duan (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device comprises a mold layer that includes multiple integrated circuit (IC) dice having contact pads, a glass core patch embedded in encapsulating material that surrounds the top, bottom, and sides of the glass core patch, and a...