US Patent Issued to Intel on Aug. 4 for "Bumps comprising tin, cooper and bismuth for liquid metal socket interconnects" (Arizona Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,042, issued on Aug. 4, was assigned to Intel Corp. (Santa Clara, Calif.).

"Bumps comprising tin, cooper and bismuth for liquid metal socket interconnects" was invented by Jiaqi Wu (Chandler, Ariz.), Xiao Lu (Chandler, Ariz.), Bohan Shan (Chandler, Ariz.) and Valery Ouvarov-Bancalero (Scottsdale, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In one embodiment, an integrated circuit apparatus comprises a substrate that includes electrical contacts on a first side of the substrate to couple the substrate to an integrated circuit die, a passivation layer on a second side of the substrate opposite the first side, metal pads on the second side of th...