US Patent Issued to Intel on Aug. 25 for "Techniques for protecting integrated circuitry from plasma-induced electrostatic discharge using a carrier substrate with junction features" (Oregon Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,180, issued on Aug. 25, was assigned to Intel Corp. (Santa Clara, Calif.).

"Techniques for protecting integrated circuitry from plasma-induced electrostatic discharge using a carrier substrate with junction features" was invented by Andy Chih-Hung Wei (Yamhill, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Techniques are provided for protecting integrated circuits from plasma-induced electrostatic discharge (ESD) using a carrier substrate with integrated junctions. According to some embodiments, the various metal features within an interconnect region above a plurality of semiconductor devices are electrically coupled to one or more conductive...