US Patent Issued to Intel on Aug. 25 for "Self-alignment of glass core halves using protruded bumps" (Arizona Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,193, issued on Aug. 25, was assigned to Intel Corp. (Santa Clara, Calif.).

"Self-alignment of glass core halves using protruded bumps" was invented by Brandon C. Marin (Gilbert, Ariz.), Sashi S. Kandanur (Phoenix), Suddhasattwa Nad (Chandler, Ariz.), Srinivas V. Pietambaram (Chandler, Ariz.), Gang Duan (Chandler, Ariz.) and Jeremy D. Ecton (Gilbert, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include cores for package substrates. In an embodiment, the core comprises a first substrate, where the first substrate comprises glass. In an embodiment, the core further comprises a first through glass via (TGV) through t...