US Patent Issued to Intel on Aug. 25 for "Methods and apparatus to increase rigidity of printed circuit boards" (Malaysian, American Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,673, issued on Aug. 25, was assigned to Intel Corp. (Santa Clara, Calif.).

"Methods and apparatus to increase rigidity of printed circuit boards" was invented by Jia Yan Go (Kulim, Malaysia), Tin Poay Chuah (Bayan Baru, Malaysia), Juha Paavola (Hillsboro, Ore.), Twan Sing Loo (Butterworth, Malaysia), Sami Heinisuo (Dallas, Ore.) and Kari Mansukoski (Hillsboro, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods, apparatus, systems, and articles of manufacture to increase rigidity of printed circuit boards are disclosed. An apparatus includes a stack of insulative layers. The stack includes a first face and a second face opposite the first fa...