US Patent Issued to Intel on Aug. 25 for "Dual-sided terminal device with split signal and power routing" (German Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,130, issued on Aug. 25, was assigned to Intel Corp. (Santa Clara, Calif.).

"Dual-sided terminal device with split signal and power routing" was invented by Bernd Waidhas (Pettendorf, Germany), Jan Proschwitz (Riesa, Germany), Stefan Reif (Munich), Vishnu Prasad (Munich) and Georg Seidemann (Landshut, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A die package comprises a semiconductor die comprising a first face, a second face on an opposing second side, an active layer located between the first face and the second face, a first electrical pathway between the first face and the active layer, a second electrical pathway between the second fa...