US Patent Issued to Intel on Aug. 18 for "Three-dimensional integration of dies in an integrated circuit device" (Arizona Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,950, issued on Aug. 18, was assigned to Intel Corp. (Santa Clara, Calif.).

"Three-dimensional integration of dies in an integrated circuit device" was invented by Jeremy D. Ecton (Gilbert, Ariz.), Brandon Christian Marin (Gilbert, Ariz.), Srinivas V. Pietambaram (Chandler, Ariz.), Gang Duan (Chandler, Ariz.) and Suddhasattwa Nad (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In one embodiment, an integrated circuit device includes a first layer having input/output (IO) hub circuitry to interconnect a plurality of integrated circuit dies, and a second layer having a plurality of integrated circuit dies electrically connected to the I...