US Patent Issued to Intel on Aug. 18 for "Integrated circuit packages including substrates with strengthened glass cores" (Arizona Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,955, issued on Aug. 18, was assigned to Intel Corp. (Santa Clara, Calif.).

"Integrated circuit packages including substrates with strengthened glass cores" was invented by Soham Agarwal (Chandler, Ariz.) and Benjamin T. Duong (Phoenix).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein are microelectronic assemblies including strengthened glass cores, as well as related devices and methods. In some embodiments, a microelectronic assembly may include a core made of glass and having a surface, the core further including a first region having a first concentration of ions and a second region having a second concentration of ions at the surf...