US Patent Issued to Intel on Aug. 18 for "Device, method, and system to protect through-dielectric vias of a composite chiplet" (Arizona, Oregon Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,924, issued on Aug. 18, was assigned to Intel Corp. (Santa Clara, Calif.).

"Device, method, and system to protect through-dielectric vias of a composite chiplet" was invented by Adel Elsherbini (Chandler, Ariz.), Mohammad Enamul Kabir (Portland, Ore.), Johanna Swan (Scottsdale, Ariz.), Omkar Karhade (Chandler, Ariz.), Kimin Jun (Portland, Ore.), Feras Eid (Chandler, Ariz.), Shawna Liff (Scottsdale, Ariz.), Xavier Brun (Hillsboro, Ore.), Bhaskar Jyoti Krishnatreya (Hillsboro, Ore.), Tushar Talukdar (Wilsonville, Ore.) and Haris Khan Niazi (Scottsdale, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Techniques and mechanisms to mitigate corrosion...