US Patent Issued to Intel on Aug. 11 for "Transistor-scale thermoelectric devices for refrigeration of integrated circuits" (Oregon Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,971, issued on Aug. 11, was assigned to Intel Corp. (Santa Clara, Calif.).

"Transistor-scale thermoelectric devices for refrigeration of integrated circuits" was invented by Abhishek Anil Sharma (Portland, Ore.) and Wilfred Gomes (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Thermoelectric (TE) devices and their manufacture on integrated circuit (IC) dies to improve thermal performance. An IC die may include a substrate with transistors on one side, a heat spreader on a second side, and a TE device between them. The TE device may have TE elements with similar dimensions as transistor features. An IC die with transistor circuitry blo...