ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,013, issued on Aug. 11, was assigned to Intel Corp. (Santa Clara, Calif.).
"Substrate with low-permittivity core and buildup layers" was invented by Brandon Christian Marin (Gilbert, Ariz.), Hamid R. Azimi (Paradise Valley, Ariz.), Sri Chaitra Jyotsna Chavali (Gilbert, Ariz.), Tarek A. Ibrahim (Mesa, Ariz.), Wei-Lun K Jen (Phoenix), Rahul Manepalli (Chandler, Ariz.) and Kevin T. McCarthy (Tempe, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "In one embodiment, a package substrate includes a substrate core, buildup layers, and one or more conductive traces. The substrate core includes at least one dielectric layer with hollow glass fibers. The ...