US Patent Issued to Intel on Aug. 11 for "Singulation of integrated circuit package substrates with glass cores" (Arizona Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,014, issued on Aug. 11, was assigned to Intel Corp. (Santa Clara, Calif.).

"Singulation of integrated circuit package substrates with glass cores" was invented by Hanyu Song (Chandler, Ariz.), Vinith Bejugam (Chandler, Ariz.), Yonggang Li (Chandler, Ariz.), Gang Duan (Chandler, Ariz.) and Aaron Garelick (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit (IC) device comprises a substrate comprising a glass core. The glass core includes a first surface, a second surface opposite the first surface, a sidewall between the first surface and the second surface, and a corner region where the first sidewall meets the first...