US Patent Issued to Intel on April 7 for "Microelectronic structure including active base substrate with through vias between a top die and a bottom die supported on an interposer" (Arizona Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,034, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.).

"Microelectronic structure including active base substrate with through vias between a top die and a bottom die supported on an interposer" was invented by Nitin A. Deshpande (Chandler, Ariz.), Omkar G. Karhade (Chandler, Ariz.), Mohit Bhatia (Chandler, Ariz.) and Debendra Mallik (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A microelectronic component and a method of forming same. The microelectronic component includes: a first substrate having first through vias therein, the first substrate including silicon or glass; a first layer on a front surface of th...