US Patent Issued to Intel on April 7 for "Composite IC die package including an electro-thermo-mechanical die (ETMD) with through substrate vias" (Arizona Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,007, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.).

"Composite IC die package including an electro-thermo-mechanical die (ETMD) with through substrate vias" was invented by Debendra Mallik (Chandler, Ariz.), Omkar Karhade (Chandler, Ariz.) and Nitin Deshpande (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Multi-die composite packages including directly bonded IC die and at least one electro-thermo-mechanical die (ETMD). An ETMD is distinguished from an active IC die as an ETMD is a passive die lacking any semiconductor devices, such as transistors. In exemplary embodiments, an ETMD includes a substrate, which ...