US Patent Issued to Intel on April 21 for "Three-dimensional interlocked corrugated capacitor structures" (Oregon, Idaho Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,565, issued on April 21, was assigned to Intel Corp. (Santa Clara, Calif.).

"Three-dimensional interlocked corrugated capacitor structures" was invented by Denzil Frost (Rio Rancho, NM, Idaho) and Sudipto Naskar (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein are IC devices with 3D interlocked corrugated capacitor structures. An example IC device includes a support structure (e.g., a substrate, a die, a wafer, or a chip), an insulator material over the support structure, and a first and a second corrugated capacitor structures extending into the insulator material, where a projection of at least one of the protrusion...