US Patent Issued to Intel on April 21 for "Readily assembled/disassembled cooling assembly for immersion cooled semiconductor chip package" (American, Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,822, issued on April 21, was assigned to Intel Corp. (Santa Clara, Calif.).

"Readily assembled/disassembled cooling assembly for immersion cooled semiconductor chip package" was invented by David Shia (Portland, Ore.), Jimmy Chuang (Taipei, Taiwan) and Jin Yang (Hillsboro, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A cooling assembly is described. The cooling assembly includes a semiconductor chip package having input/outputs (I/Os) on a first surface and a package lid that is opposite the first surface, the semiconductor chip package has sides between the first surface and the package lid. The cooling assembly includes a structured elemen...