US Patent Issued to Intel on April 21 for "Metal matrix composite layers for heat dissipation from integrated circuit devices" (American, Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,817, issued on April 21, was assigned to Intel Corp. (Santa Clara, Calif.).

"Metal matrix composite layers for heat dissipation from integrated circuit devices" was invented by Wenhao Li (Chandler, Ariz.), Feras Eid (Chandler, Ariz.) and Yoshihiro Tomita (Tsukuba, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit assembly may be fabricated to include an integrated circuit device having a backside surface and a metal matrix composite layer on the backside surface, wherein the metal matrix composite layer has a filler material disposed therein to reduce the coefficient of thermal expansion thereof. The filler material may be ...