US Patent Issued to Intel on April 14 for "Universal electrically inactive devices for integrated circuit packages" (Oregon, Arizona Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,522, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.).

"Universal electrically inactive devices for integrated circuit packages" was invented by Xavier Brun (Hillsboro, Ore.) and Timothy Gosselin (Phoenix).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit package may be fabricated with a universal dummy device, instead of utilizing a dummy device that matches the bump layer of an electronic substrate of the integrated circuit package. In one embodiment, the universal dummy device may comprise a device substrate having an attachment surface and a metallization layer on the attachment surface, wherein the metall...