US Patent Issued to Intel on April 14 for "Shield to reduce substrate electromagnetic interference and warpage" (Malaysian, American, Indian Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,736, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.).

"Shield to reduce substrate electromagnetic interference and warpage" was invented by Telesphor Kamgaing (Chandler, Ariz.), Chu Aun Lim (Hillsboro, Ore.), Eng Huat Goh (Ayer Itam, Malaysia), Min Suet Lim (Gelugor, Malaysia), Kavitha Nagarajan (Bangalore, India), Jooi Wah Wong (Bukit Mertajam, Malaysia) and Chee Kheong Yoon (Bayan Lepas, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments herein relate to systems, apparatuses, techniques, or processes for stiffeners for a surface of a package substrate, where the stiffeners provide EMI/RFI shielding for signa...