ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,733, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.).
"Package structures with collapse control features" was invented by Wenhao Li (Chandler, Ariz.), Feras Eid (Chandler, Ariz.), Michael Baker (Gilbert, Ariz.), Pilin Liu (Chandler, Ariz.) and Zhaozhi Li (Chandler, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Microelectronic die package structures formed according to some embodiments may include a substrate comprising one or more conductive interconnect structures on a surface of the substrate. One or more support features are on one or more peripheral regions of the surface of the substrate. A first side of a die is c...