US Patent Issued to Intel on April 14 for "Module with improved thermal cooling performance" (Canadian, Indian, American Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,438, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.).

"Module with improved thermal cooling performance" was invented by Ali Kalantarian (Richmond Hill, Canada), Malcolm Gutenburg (Vancouver, Canada), Andrew Randell (Waterloo, Canada), Mirui Wang (Oshawa, Canada), Tejas Shah (Austin, Texas), Tamara J. Low Foon (Toronto), Jason Lee Pack (North York, Canada), Yvan Large (Richmond Hill, Canada), Shahin Amiri (Richmond Hill, Canada), Saanjali Maharaj (Toronto), Srinivasarao Konakalla (Bangalore, India), Feroze Khan (Bangalore, India), Nagaraj K (Bangalore, India), Babu Triplicane Gopikrishnan (Bangalore, India) and Yogesh Channaiah (Mandya, India).

According to...