US Patent Issued to Intel on April 14 for "Microelectronic assemblies including stiffeners around individual dies" (German, American Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,759, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.).

"Microelectronic assemblies including stiffeners around individual dies" was invented by Pouya Talebbeydokhti (Gilbert, Ariz.), Mohan Prashanth Javare Gowda (Ottobrunn, Germany), Sonja Koller (Bavaria, Germany), Stephan Stoeckl (Schwandorf, Germany), Thomas Wagner (Regelsbach, Germany) and Wolfgang Molzer (Ottobrunn, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein are microelectronic assemblies, as well as related apparatuses and methods. In some embodiments, a microelectronic assembly may include a substrate; a lid surrounding an individual die, whe...