US Patent Issued to Intel on April 14 for "Methods and apparatus to reduce thickness of on-package memory architectures" (Malaysian Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,762, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.).

"Methods and apparatus to reduce thickness of on-package memory architectures" was invented by Eng Huat Goh (Ayer Itam, Malaysia), Jiun Hann Sir (Gelugor, Malaysia) and Poh Boon Khoo (Perai, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and apparatus to reduce thickness of on-package memory architectures are disclosed. An on-package memory architecture includes a memory die; a bonding pad including a first surface and a second surface opposite the first surface; a wire bond electrically coupling the memory die to the first surface of the bonding pad; and a...