ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,010, issued on Feb. 24, was assigned to Intel NDTM US LLC (Santa Clara, Calif.).
"Chuck with non-flat shaped surface" was invented by Hongpeng Yu (Liaoning, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment of an apparatus may include a chuck body, and a surface formed on the chuck body to hold a wafer, where the surface has a non-flat shape. Other embodiments are disclosed and claimed."
The patent was filed on Dec. 7, 2021, under Application No. 17/544,072.
*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch...