ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,859, issued on Nov. 3, was assigned to INTEL FOUNDRY IP LLC (Santa Clara, Calif.).
"Three-dimensional stack cooling wings" was invented by Sonja Koller (Lappersdorf, Germany), Vishnu Prasad (Munich), Bernd Waidhas (Pettendorf, Germany), Eduardo De Mesa (Munich), Lizabeth Keser (San Diego), Thomas Wagner (Regelsbach, Germany), Mohan Prashanth Javare Gowda (Ottobrunn, Germany), Abdallah Bacha (Munich) and Jan Proschwitz (Riesa, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein are microelectronic packages having thermally conductive layers and methods for manufacturing the same. The microelectronics packages may include a substrat...