US Patent Issued to INSTITUTE OF SEMICONDUCTORS, GUANGDONG ACADEMY OF SCIENCES on Oct. 6 for "Chiplet-fine-interconnection-package structure and method of manufacturing the same" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,767, issued on Oct. 6, was assigned to INSTITUTE OF SEMICONDUCTORS, GUANGDONG ACADEMY OF SCIENCES (Guangzhou, China).

"Chiplet-fine-interconnection-package structure and method of manufacturing the same" was invented by Xun Xiang (Guangzhou, China), Chuan Hu (Guangzhou, China), Yingqiang Yan (Guangzhou, China), Yunzhi Ling (Guangzhou, China), Zhikuan Chen (Guangzhou, China) and Zhitao Chen (Guangzhou, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a method of manufacturing a chiplet-fine-interconnection-package structure, comprising: mounting at least two chips on a first side surface of a substrate and preparing a temporary bondin...