US Patent Issued to INSTITUTE OF CHEMISTRY, CHINESE ACADEMY OF SCIENCES on April 7 for "3D printing device, and method for preparing 3D printed structure" (Chinese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,594,715, issued on April 7, was assigned to INSTITUTE OF CHEMISTRY, CHINESE ACADEMY OF SCIENCES (Beijing).

"3D printing device, and method for preparing 3D printed structure" was invented by Lei Wu (Beijing) and Yanlin Song (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are a 3D printing device, and a method for preparing a 3D printed structure. The device comprises a curing system (1), and a curing pattern player (6), a flat curing surface (2) with dewettability, and a receiving base (4) capable of moving upwards and away from the flat curing surface, with same being successively arranged above the curing system (1), wherein a curing...