ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,709, issued on Nov. 3, was assigned to INNOX Advanced Materials Co. Ltd. (Asan-si, South Korea).
"Adhesive sheet for semiconductor device" was invented by Keun-Young Yoon (Asan-si, South Korea), Young-Gun Kim (Asan-si, South Korea), Yeong-Seok Cho (Asan-si, South Korea), Duck-Soo Kim (Asan-si, South Korea) and Do-Woo Ki (Asan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An adhesive sheet for a semiconductor device includes a dicing tape integrated backside protective film disposed at predetermined intervals in a longitudinal direction of a separator, and a support film disposed to be spaced apart from the outside of the dicing tape ...