ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,716, issued on March 31, was assigned to Innolux Corp. (Miao-Li County, Taiwan).

"Substrate assembly and electronic device including the same" was invented by Maggy Hsu (Tainan City, Taiwan) and Pierre Chen (Tainan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate assembly and an electronic device are provided. The substrate assembly includes a substrate, a first metal layer, a second metal layer, a first conductive layer, and an insulating layer. The first metal layer is disposed on the substrate. The second metal layer is disposed on the substrate. The first conductive layer is disposed between the first metal layer and the ...