ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,733, issued on March 31, was assigned to INGENTEC Corp. (Zhunan Township, Taiwan).
"Vertical light emitting diode die packaging method" was invented by Hsiao Lu Chen (Zhunan Township, Taiwan), Ai Sen Liu (Zhunan Township, Taiwan) and Hsiang An Feng (Zhunan Township, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A vertical light emitting diode die packaging method is provided, including a plurality of following steps. At first, a plurality of drill hole is formed in a substrate and a first metal material is used to fill the drill holes. Next, disposing and fixing a plurality of vertical light emitting diode die on the substrate through a sec...