US Patent Issued to INGENTEC on June 16 for "Light-emitting diode package structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,396, issued on June 16, was assigned to INGENTEC Corp. (Miaoli County, Taiwan).

"Light-emitting diode package structure and manufacturing method thereof" was invented by Ai-Sen Liu (Miaoli County, Taiwan), Hsiao-Lu Chen (Miaoli County, Taiwan), Yi-Chuan Huang (Miaoli County, Taiwan) and Hsiang-An Feng (Miaoli County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method of a light-emitting diode package structure includes the steps as follows. A substrate is provided. At least one light-emitting diode and at least one dummy plug are arranged on the substrate in an arranging step. The light-emitting diode and the dummy plug are...