ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,730,135, issued on Sept. 8, was assigned to Infineon Technologies AG (Neubiberg, Germany).
"Chip package with contact clip" was invented by Horst Theuss (Wenzenbach, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "According to an exemplary embodiment, a semiconductor component includes a chip carrier, a semiconductor chip mounted on the chip carrier, and a chip package made of potting compound. The potting compound only partially surrounds the semiconductor chip, such that at least part of an upper side of the semiconductor chip is not covered by the potting compound. The semiconductor component further includes a clip that is mechanically connec...