US Patent Issued to Infineon Technologies on Sept. 1 for "Semiconductor devices including a premolded leadframe and a semiconductor package" (German Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,489, issued on Sept. 1, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Semiconductor devices including a premolded leadframe and a semiconductor package" was invented by Thorsten Scharf (Lappersdorf, Germany), Josef Hoglauer (Kirchheim-Heimstetten, Germany), Angela Kessler (Sinzing, Germany) and Claus Waechter (Sinzing, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a premolded leadframe, including a main surface, at least one electrical contact extending out of the main surface, and an opposite main surface arranged opposite to the main surface. The semiconductor device further includes a sem...