US Patent Issued to Infineon Technologies on Oct. 6 for "Semiconductor module arrangement" (German Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,794, issued on Oct. 6, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Semiconductor module arrangement" was invented by Christian Muller (Schweinfurt, Germany) and Jan Baurichter (Paderborn, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A power semiconductor module arrangement includes a substrate including a dielectric insulation layer and a first metallization layer arranged on a first side of the dielectric insulation layer, wherein the first metallization layer includes a plurality of different sections that are separate and distinct from each other, and a plurality of semiconductor bodies arranged on the first metalliza...