US Patent Issued to Infineon Technologies on Oct. 27 for "Power semiconductor module and power electronics device" (German Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,776,715, issued on Oct. 27, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Power semiconductor module and power electronics device" was invented by Waldemar Jakobi (Soest, Germany), Christoph Koch (Salzkotten, Germany), Tomas Manuel Reiter (Munich) and Christian Schweikert (Munich).

According to the abstract* released by the U.S. Patent & Trademark Office: "A power semiconductor module includes: an electrically insulative frame; half bridge circuits housed in the electrically insulative frame, each half bridge circuit including one or more high-side power semiconductor dies and one or more low-side power semiconductor dies; a first structured metal frame embedded in ...