US Patent Issued to Infineon Technologies on Nov. 3 for "Semiconductor module with shaped external contact for reduced crack formation in the encapsulation body" (German Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,857, issued on Nov. 3, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Semiconductor module with shaped external contact for reduced crack formation in the encapsulation body" was invented by Christoph Liebl (Munich), Stefan Schwab (Regensburg, Germany), Adrian Lis (Regensburg, Germany), Michael Ledutke (Saal, Germany) and Lisa Aschenbrenner (Kelheim, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module includes: a chip carrier having a first side and a second, opposite side; a semiconductor chip arranged on the first side of the chip carrier; an encapsulation body that encapsulates the semiconductor chip; and...