US Patent Issued to Infineon Technologies on Nov. 3 for "Power semiconductor module arrangement" (Hungarian Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,896, issued on Nov. 3, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Power semiconductor module arrangement" was invented by Akos Ferenc Hegedus (Budapest, Hungary).

According to the abstract* released by the U.S. Patent & Trademark Office: "A power semiconductor module arrangement includes: a housing; a substrate arranged in or forming a bottom of the housing, the substrate including a dielectric insulation layer and a first metallization layer attached to the dielectric insulation layer; a semiconductor arrangement on the substrate; and bus bars electrically coupled to each other by the semiconductor arrangement and/or the first metallization layer. Each bus ba...