US Patent Issued to Infineon Technologies on Nov. 3 for "Package with electrically insulating and thermally conductive layer on top of electronic component" (Malaysian Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,772, issued on Nov. 3, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Package with electrically insulating and thermally conductive layer on top of electronic component" was invented by Shih Kien Long (Melaka, Malaysia) and Chee Pin Haw (Melaka, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package is disclosed. In one example, the package comprises a carrier, an electronic component mounted on or above the carrier, an electrically insulating and thermally conductive layer on at least part of an upper main surface of the electronic component, and a metal block on the electrically insulating and thermally conductive layer....