US Patent Issued to Infineon Technologies on May 26 for "Power semiconductor module arrangement and method for producing a power semiconductor module arrangement" (German, Austrian Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,642,152, issued on May 26, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Power semiconductor module arrangement and method for producing a power semiconductor module arrangement" was invented by Andre Arens (Ruthen, Germany), Jens de Bock (Wadersloh, Germany), Xi Zhang (Erwitte, Germany) and Dietmar Spitzer (Volkermarkt, Austria).

According to the abstract* released by the U.S. Patent & Trademark Office: "A power semiconductor module arrangement includes: a housing; a substrate having a substrate layer and a first metallization layer on a first side of the substrate layer, inside the housing or forming a bottom of the housing; a printed circuit board inside the housi...